The tin plating process is used to protect both ferrous and nonferrous surfaces. Tin is a useful metal for the food processing industry since it is non-toxic, ductile and corrosion resistant. The excellent ductility of allows a tin coated base metal sheet to be formed into a variety of shapes without damage to the tin layer. It provides sacrificial protection for copper, nickel and other non-ferrous metals, but not for steel. Tin is also widely used in the electronics industry because of its ability to protect the base metal from oxidation, improving solderability and electrical conductivity. Below is the most common specification for tin plating.


Type 1 – Electrodeposited

0.0001 to 0.00025 inch (2.5 to 6.4 um) for “tin flashing” of articles to be soldered

0.0002 to 0.0004 inch (5 to 10 um) for articles to prevent galling or seizing

0.0003 inch (7.6 um) minimum for articles generally plated to prevent corrosion of basis metals

0.0002 to 0.0006 inch (5 to 15 um) for articles to prevent formation of case during nitriding